Evolution of AIDC Infrastructure: Vertiv Releases the "White Paper on the Evolution of Intelligent Computing Center Infrastructure"

31 Jul.,2025

As AI computing power demand grows, cooling is key to the efficiency of intelligent computing centers. Vertiv’s White Paper on the Evolution of Intelligent Computing Center Infrastructure introduces the “Golden Triangle” model, optimizing cooling across chip-level, cabinet/air conditioning, and cooling sources. It offers insights to help businesses choose the most energy-efficient solutions.

 

In the global AI race, intelligent computing centers are emerging as the engines of new productivity, experiencing exponential growth. Data shows that by 2025, global AI computing power demand will surge several times over. Behind this computing boom, cooling systems have become a crucial yet often overlooked battlefield, determining the efficiency and competitiveness of intelligent computing centers.

With multiple cooling technologies available, how can businesses choose the optimal solution to achieve high performance, efficiency, and sustainability in intelligent computing centers?

Vertiv has unveiled its latest White Paper on the Evolution of Intelligent Computing Center Infrastructure, offering definitive answers based on extensive experience in data center construction.

The Ultimate Battle Between Computing and Thermal Management

(Insert Image: A visualization of the increasing demand for computing power vs. cooling challenges in intelligent computing centers.)

As single cabinet power density leaps from tens of kW to over 100 kW, intelligent computing centers face an escalating challenge: the more powerful the computing, the harder it is to dissipate heat. Traditional cooling methods are encountering multiple hurdles, including:

  • Chip thermal density exceeding conventional cooling limits
  • Dynamic heat load fluctuations caused by heterogeneous computing
  • The need to balance reliability and energy efficiency
  • The challenge of adapting to different application scenarios

Different cooling solutions have their own limitations, adding complexity to the decision-making process:

  1. Air Cooling – Reliable and cost-effective, still a staple for low-density server rooms, but struggling with high power density scenarios.
  2. Liquid Cooling – Offers precise temperature control, making it ideal for AI clusters, but comes with high costs.
  3. Integrated Refrigerant Pump Systems – Enables quick deployment and efficient use of natural cooling but requires customization for broader application.
  4. Evaporative Cooling – Provides exceptional energy efficiency but is restricted by environmental conditions.

This multi-dimensional dilemma underscores the urgent need for a more strategic decision-making approach, laying the foundation for Vertiv’s white paper.

Building the "Golden Triangle" for Intelligent Cooling

Evolution of AIDC Infrastructure: Vertiv Releases the "White Paper on the Evolution of Intelligent Computing Center Infrastructure"

The White Paper on the Evolution of Intelligent Computing Center Infrastructure introduces a three-step methodology for selecting the optimal cooling solution, covering the entire cooling chain—from chip (server) side to cabinet/air conditioning side and cooling source side—forming the intelligent cooling “Golden Triangle”:

  1. Chip-Level Cooling for Precise Temperature Control

    • Technologies such as air-cooled chips, single-phase cold plate liquid cooling, and phase-change liquid cooling ensure stable and efficient computing performance.
  2. Cabinet/Air Conditioning Cooling for High Efficiency

    • Tailored air and liquid cooling solutions maximize energy efficiency in varying power density scenarios.
  3. Cooling Source Adaptability for Different Environments

    • A professional evaluation model ensures the best cooling strategy based on specific infrastructure and environmental conditions.

(Insert Image: Comparison chart of different cooling technologies and their efficiency, cost, and applicability.)

To aid in cooling solution selection, the white paper evaluates key factors including reliability, energy efficiency, initial investment, rack density, scalability, building compatibility, rooftop footprint, and noise levels. By providing comprehensive and detailed parameters, the report enables businesses to identify the most suitable cooling approach for their intelligent computing centers.

In this era where computing power equates to productivity, cooling systems have become the deciding factor in the success of intelligent computing centers. The White Paper on the Evolution of Intelligent Computing Center Infrastructure serves as an industry beacon, transforming the challenge of heat dissipation into an opportunity for technological innovation.

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