As AI computing power demand grows, cooling is key to the efficiency of intelligent computing centers. Vertiv’s White Paper on the Evolution of Intelligent Computing Center Infrastructure introduces the “Golden Triangle” model, optimizing cooling across chip-level, cabinet/air conditioning, and cooling sources. It offers insights to help businesses choose the most energy-efficient solutions.
In the global AI race, intelligent computing centers are emerging as the engines of new productivity, experiencing exponential growth. Data shows that by 2025, global AI computing power demand will surge several times over. Behind this computing boom, cooling systems have become a crucial yet often overlooked battlefield, determining the efficiency and competitiveness of intelligent computing centers.
With multiple cooling technologies available, how can businesses choose the optimal solution to achieve high performance, efficiency, and sustainability in intelligent computing centers?
Vertiv has unveiled its latest White Paper on the Evolution of Intelligent Computing Center Infrastructure, offering definitive answers based on extensive experience in data center construction.
The Ultimate Battle Between Computing and Thermal Management
(Insert Image: A visualization of the increasing demand for computing power vs. cooling challenges in intelligent computing centers.)
As single cabinet power density leaps from tens of kW to over 100 kW, intelligent computing centers face an escalating challenge: the more powerful the computing, the harder it is to dissipate heat. Traditional cooling methods are encountering multiple hurdles, including:
Different cooling solutions have their own limitations, adding complexity to the decision-making process:
This multi-dimensional dilemma underscores the urgent need for a more strategic decision-making approach, laying the foundation for Vertiv’s white paper.
Building the "Golden Triangle" for Intelligent Cooling
The White Paper on the Evolution of Intelligent Computing Center Infrastructure introduces a three-step methodology for selecting the optimal cooling solution, covering the entire cooling chain—from chip (server) side to cabinet/air conditioning side and cooling source side—forming the intelligent cooling “Golden Triangle”:
Chip-Level Cooling for Precise Temperature Control
Cabinet/Air Conditioning Cooling for High Efficiency
Cooling Source Adaptability for Different Environments
(Insert Image: Comparison chart of different cooling technologies and their efficiency, cost, and applicability.)
To aid in cooling solution selection, the white paper evaluates key factors including reliability, energy efficiency, initial investment, rack density, scalability, building compatibility, rooftop footprint, and noise levels. By providing comprehensive and detailed parameters, the report enables businesses to identify the most suitable cooling approach for their intelligent computing centers.
In this era where computing power equates to productivity, cooling systems have become the deciding factor in the success of intelligent computing centers. The White Paper on the Evolution of Intelligent Computing Center Infrastructure serves as an industry beacon, transforming the challenge of heat dissipation into an opportunity for technological innovation.
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